Japan, Jan. 21 -- SEMICONDUCTOR ENERGY LAB CO LTD has got intellectual property rights for 'SEMICONDUCTOR DEVICE.' Other related details are as follows: Application Number: JP,2024-110745 Category (... Read More
Japan, Jan. 21 -- KARSTEN MANUFACTURING CORP has got intellectual property rights for 'IRON-TYPE GOLF CLUB HEAD WITH FLEX STRUCTURE.' Other related details are as follows: Application Number: JP,2024... Read More
Japan, Jan. 21 -- CASIO COMPUT CO LTD has got intellectual property rights for 'MOBILE TERMINAL.' Other related details are as follows: Application Number: JP,2024-131921 Category (FI): H05K5/02@L,G... Read More
Japan, Jan. 21 -- TOSHIBA CORP,TOSHIBA INFRASTRUCTURE SYSTEMS & SOLUTION CORP has got intellectual property rights for 'USER IDENTIFICATION SYSTEM AND USER IDENTIFICATION METHOD.' Other related detail... Read More
Japan, Jan. 21 -- TOSHIBA TEC CORP has got intellectual property rights for 'DISPLAY CONTAINER.' Other related details are as follows: Application Number: JP,2024-129048 Category (FI): G06Q30/06,A47... Read More
Japan, Jan. 21 -- HUAWEI TECHNOLOGIES CO LTD has got intellectual property rights for 'CHANNEL CONTENTION METHOD AND RELATED APPARATUS.' Other related details are as follows: Application Number: JP,2... Read More
Japan, Jan. 21 -- NIIGATA KIKAI CO LTD has got intellectual property rights for 'CLAMPING DEVICE OF MOLDING MACHINE.' Other related details are as follows: Application Number: JP,2023-062772 Categor... Read More
Japan, Jan. 21 -- TOYOTA MOTOR CORP has got intellectual property rights for 'CONNECTION STRUCTURE OF CARTRIDGE AND GAS CONSUMPTION DEVICE.' Other related details are as follows: Application Number: ... Read More
Japan, Jan. 21 -- TOYOTA MOTOR CORP has got intellectual property rights for 'VEHICLE CONTROL APPARATUS, CONTROL METHOD, AND PROGRAM.' Other related details are as follows: Application Number: JP,202... Read More
Japan, Jan. 21 -- DENSO CORP has got intellectual property rights for 'CHARGING SYSTEM AND COMPUTER PROGRAM FOR ELECTRIC VEHICLE.' Other related details are as follows: Application Number: JP,2023-06... Read More